PCB

Teach you how to use X-Ray to check the solderability of BGA solder balls

The circuit board manufacturer and circuit board designer explain how to use X-Ray to check the solderability of BGA solder ball

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Function and Operation Procedure of Bottom Filler in PCB Production

The circuit board manufacturer and circuit board designer explain the function and operation procedure of bottom filler in PCB production

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Detailed introduction of COB customization process

PCB manufacturers and PCB designers explain the customization process of COB

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Analysis of the Causes of PCB Open Circuit and Improvement Methods

This article mainly introduces the causes and improvement methods of PCB open circuit

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Design Method and Key Points Analysis of PCB Circuit Board Diagram

This article mainly introduces the design method and key points analysis of PCB circuit board diagram

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Several Key Points in Post inspection of PCB Design

This article mainly introduces several key points of post inspection of PCB design

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Detailed explanation of the principle of PCB solder

The circuit board manufacturer and circuit board designer will explain the principle of circuit board solder to you in detail

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What are the main assembly failure mechanisms of the circuit board?

The circuit board manufacturer and circuit board designer explain to you the main assembly failure mechanisms of the circuit board?

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Detailed explanation of three common drilling methods for PCB

This article mainly introduces three common drilling methods for PCB

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Eight classic answers about PCB wiring tips

This article mainly introduces eight classic answers about PCB wiring tips

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Test method for low-temperature embrittlement and lead-free soldering of solders for circuit boards

Why soldering tin of circuit board becomes brittle at low temperature and change of inspection method for lead-free soldering

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Prevent PCB board from bending and warping when passing through the reflow furnace

The circuit board manufacturer and circuit board design manufacturer explain how to prevent PCB from bending and warping when passing through the back soldering furnace.

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