Technical principle and operation steps of PCBA gas phase cleaning

TechnICal principle and operation steps of PCBA gas phase cleaning

The vapor phase cleaning of PCBA is a wave soldering cleaning method that heats the solvent by the equipment, vaporizes the solvent, evaporates and condenses the solvent vapor continuously, and makes the cleaned PCB workpiece "sweat" continuously and bring out pollutants. In order to improve the cleaning effect of PCBA cleaning, it is usually used in combination with ultrasonic cleaning.

The vapor phase cleaning of PCBA is a wave soldering cleaning method that heats the solvent by the equipment, vaporizes the solvent, evaporates and condenses the solvent vapor continuously, and makes the cleaned PCB workpiece "sweat" continuously and bring out pollutants. In order to improve the cleaning effect of PCBA cleaning, it is usually used in combination with ultrasonic cleaning.

Technical principle and operation steps of PCBA gas phase cleaning

1、 Gas phase cleaning principle

The bottom of the gas phase cleaning equipment is a heating immersion device and an ultrasonic cleaning tank. Several round cold meter tubes are instalLED around the tank wall above the cleaning, where a condensation temperature zone ring is formed. When the solvent is heated to the gasification temperature, it begins to evaporate, and also evaporates to the workpiece to be cleaned. When the solvent vapor rises to the annular condenser, the solvent vapor condenses and falls on the workpiece to be cleaned. Because the solvent vapor is very pure, the solvent vapor is constantly evaporated and condensed, making the cleaned workpiece constantly "sweat" and bringing out pollutants generated during SMT chip processing and post soldering.

2、 Gas phase cleaning process

① First, soak the workpiece in the heated cleaning solvent to form pollutants.

② Ultrasonic cleaning can free contaminants on the workpiece surface.

③ Vapor phase cleaning, which is equivalent to kudzu gas, is very pure. The solvent is used to "sweat" the cleaned workpiece and bring out pollutants.

④ Rinse with cleaner cleaning solvent.

⑤ Finally, spray with clean detergent solvent.

The gas phase cleaning equipment of PCBA has two structures: single tank and multi tank type. When the single tank type cleaning machine is used for cleaning, the workpiece to be cleaned will move up and down. First, heat the bottom of the cleaning tank for soaking and ultrasonic cleaning, then lift the cleaning workpiece to the place between the soaking sound tank and the cold pipe for gas phase cleaning, and finally use the clean cleaning solution base. When the multi tank type cleaning machine is used for cleaning, the workpiece to be cleaned will move laterally from the first tank to the last tank, Heat soak and ultrasonic cleaning in the first tank, conduct vapor phase cleaning at the same time, rinse in the second tank (some equipment has three rinsing tanks), then lift the cleaned workpiece up and spray it with clean solvent. Finally, it shall be dried naturally in an exhaust environment. Single and double grooves are adopted for SMAll batch, and multi grooves are adopted for large batch.