Viscosity Control Method of SMT Solder Paste

Viscosity Control Method of SMT solder Paste
Generally, the viscosity of solder paste used in SMT wafer processing is 1.80-200Pa/s If the viscosity of solder paste is low, the solder paste is too thin At this time, process problems may occur, such as collapse, false welding, tombstone, tin bead, shortage, and BGA clearing during printing How to detect and control the viscosity of solder paste
⠀ƒ ⠀ƒ 1. The viscosity of solder paste will increase with the decrease of workshop temperature. In general, it is recommended that the workshop temperature be 25 ± 2.5 degrees, preferably not more than 28 degrees. Decrease on the contrary;
⠀ƒ ⠀ƒ 2. If the diameter area of the solder paste is large when printed on the mold, the viscosity will be high, otherwise the viscosity will be low. We usually choose the roll diameter of solder paste as 10-15; ⠀ƒ ⠀ƒ
⠀ƒ 3. The higher the printing speed of solder paste, the lower the viscosity.

Since the viscosity of solder paste is inversely proportional to the angular velocity of motion, we can adjust the scraper speed appropriately At the same time, the viscosity of solder paste will decrease with the mixing of solder paste Stop stirring and let it stand for a while, and the viscosity of the solder paste will recover;
⠀ƒ ⠀ƒ 4. The angle of the scraper will also affect the viscosity of the solder paste. The greater the angle, the greater the viscosity, and vICe versa. Two types of scraper are usually used, 45 degrees or 60 degrees.
What are SMT placement skills? What are the advantages of using SMT patch technology? How to implement SMT placement skills? This article will explain one by one
1. What are SMT placement skills?
SMT placement skills are also calLED SMT placement skills or SMT equipment skills. The full name of SMT is Surfaxd Installation Technology. SMT skills are a new generation of high-tech electronic placement skills and new industrial manufacturing skills and processes. Its main function is to quickly install electronIC components on PCB through placement technology to achieve high power., High density, high reliability, low cost and other production process automation.
2. What are the advantages of using SMT patch technology?
With the increasingly competitive MARKet, it is necessary to reduce product costs in order to make a living., Advantages in labor cost, productivity and product quality. SMT technology can effectively improve production capacity, reduce costs and ensure quality.
(1) Improve productivity and reduce labor and product costs
The biggest feature of SMT chip technology is the completion of automation, which can effectively improve production capacity and save data., Energy, manpower, time, etc., effectively reduce costs by 30% - 50%. The rise of Surface Mount Technology makes electronic assembly easier. Recall that many electronic products are upgrading, the integration level is improving, and the price is getting lower and lower.
(2) Ensure product quality and improve reliability
surface mount technology can ensure that the solder joint defect rate of electronic products or components is low., High frequency characteristics. In this case, electronic components or electronic products using SMT chip technology have high vibration resistance., High reliability, reducing electromagnetic and radio frequency interference.
(3) Basis for the transformation of electronic products to miniaturization
Nowadays, the device density of electronic products is getting higher and higher, The volume is getting SMAller and smaller, The weight is getting lighter and lighter The size and weight of the chip module is only about 10 times that of the traditional chip module, even very small After selecting SMT chip technology, the volume of electronic products can be reduced to 40% - 60% and the weight can be reduced to 60% - 80%

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